Microstrip antennas for wireless power transmitters

ABSTRACT

A microstrip antenna for use in a wireless power transmission system and a method for forming the microstrip antenna are described. The antenna includes a first multi-layer printed circuit board (PCB) that includes a top surface and a bottom surface. The top and bottom surfaces of the first multi-layer PCB include a first electrically conductive material. The antenna includes a second multi-layer PCB that includes a top surface and a bottom surface. The top and bottom surfaces of the second multi-layer PCT include a second electrically conductive material. A first plurality of vias each substantially pass through the top and bottom surfaces of the first multi-layer PCB. A second plurality of vias each substantially pass through the top and bottom surfaces of the second multi-layer PCB. The antenna further comprises a dielectric slab that is configured to receive the first multi-layer PCB and the second multi-layer PCB.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/414,464, filed on Jan. 24, 2017, entitled “Microstrip Antennas ForWireless Power Transmitters,” which is hereby incorporated by referencein its entirety.

TECHNICAL FIELD

The disclosed embodiments relate generally to wireless powertransmission systems, and in particular, to microstrip antennas forwirelessly transmitting and/or receiving power.

BACKGROUND

Portable electronic devices, such as laptop computers, mobile phones,tablets, and other electronic devices, require frequent charging of apower-storing component (e.g., a battery) to operate. Many electronicdevices require charging one or more times per day. Often, charging anelectronic device requires manually connecting an electronic device toan outlet or other power source using a wired charging cable. In somecases, the power-storing component is removed from an electronic deviceand inserted into charging equipment. Accordingly, charging is timeconsuming, burdensome, and inefficient because users must carry aroundmultiple charging cables and/or other charging devices, and frequentlymust locate appropriate power sources to charge their electronicdevices. Additionally, conventional charging techniques potentiallydeprive a user of the ability to use the device while it is charging,and/or require the user to remain next to a wall outlet or other powersource to which their electronic device or other charging equipment isconnected.

Additionally, existing patch antennas used for transmission of powerwaves have large cross-sectional areas, such as 6″ by 6″ fortransmission of power waves at a frequency of 900 MHz. Due to theselarge cross-sectional areas, integrating these existing patch antennaswith consumer electronic devices results in noticeable and undesiredchanges to an aesthetic appearance of the consumer electronic devices,thereby reducing the likelihood that consumers will be willing toinstall such devices in their homes, office spaces, and other areas.

SUMMARY

There is a need for improved antenna designs that help to address theshortcomings of conventional charging systems described above. Inparticular, there is a need for antennas (e.g., microstrip antennas)that have a form factor that is suitable for integration with consumerdevices. The antennas described herein address these shortcomings andhave a form factor that is suitable for integration with consumerdevices. For example, in some embodiments the antennas discussed hereinhave a largest cross-sectional dimension of approximately two inches,making integration with consumer devices such as sound bars,televisions, media entertainment systems, light fixtures, portable airconditioning/heater systems, dashboard and glove compartments inautomobiles, devices embedded in seat-backs (e.g., in trains, busses andairplanes), advertisement panels, and other consumer devices appropriatewithout impacting aesthetic appeal of these consumer devices, therebyensuring that consumers will be more receptive to installing suchtransmitter devices (e.g., a sound bar with the novel microstrip antennaintegrated therein) in their homes, offices, and other spaces.

In some embodiments, an antenna for use in a wireless power transmissionsystem includes a first multi-layer printed circuit board (PCB) thatincludes a top surface and a bottom surface that is opposite the topsurface, and the top and bottom surfaces of the first multi-layer PCBinclude a first electrically conductive material. The antennaadditionally comprises a second multi-layer PCB that includes a topsurface and a bottom surface that is opposite the top surface, and thetop and bottom surfaces of the second multi-layer PCT include a secondelectrically conductive material. A first plurality of vias eachsubstantially pass through the top and bottom surfaces of the firstmulti-layer PCB. A second plurality of vias each substantially passthrough the top and bottom surfaces of the second multi-layer PCB. Theantenna further includes a dielectric slab that is configured to receivethe first multi-layer PCB and the second multi-layer PCB.

In some embodiments, a method for forming an antenna includes forming adielectric assembly by coupling a dielectric slab to a first multi-layerPCB and a second multi-layer PCB. The first multi-layer PCB includes atop surface and a bottom surface that is opposite the top surface. Thetop and bottom surfaces of the first multi-layer PCB include a firstelectrically conductive material. A first plurality of vias eachsubstantially pass through the top and bottom surfaces of the firstmulti-layer PCB. The second multi-layer PCB includes a top surface and abottom surface that is opposite the top surface. The top and bottomsurfaces of the second multi-layer PCT include a second electricallyconductive material. A second plurality of vias each substantially passthrough the top and bottom surfaces of the second multi-layer PCB. Themethod also includes coupling at least one feed to the dielectricassembly.

Note that the various embodiments described above can be combined withany other embodiments described herein. The features and advantagesdescribed in the specification are not all inclusive and, in particular,many additional features and advantages will be apparent to one ofordinary skill in the art in view of the drawings, specification, andclaims. Moreover, it should be noted that the language used in thespecification has been principally selected for readability andinstructional purposes, and may not have been selected to delineate orcircumscribe the inventive subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the present disclosure can be understood in greater detail, amore particular description may be had by reference to the features ofvarious embodiments, some of which are illustrated in the appendeddrawings. The appended drawings, however, merely illustrate pertinentfeatures of the present disclosure and are therefore not to beconsidered limiting, for the description may admit to other effectivefeatures.

FIG. 1 illustrates components of a wireless power transmission system,in accordance with some embodiments.

FIG. 2 illustrates a cross-sectional view of a microstrip antenna, inaccordance with some embodiments.

FIG. 3 illustrates a top view of a multi-layer PCB, in accordance withsome embodiments.

FIG. 4 is used to illustrate dimensions of a microstrip antenna, inaccordance with some embodiments.

FIG. 5 is an expanded view of a multi-layer PCB that illustrates amaterial formed on the interior surfaces of vias, in accordance withsome embodiments.

FIG. 6 illustrates an array of microstrip antennas, in accordance withsome embodiments.

FIGS. 7A-7C are a flowchart representation of a method for forming anantenna, in accordance with some embodiments.

In accordance with common practice, the various features illustrated inthe drawings may not be drawn to scale. Accordingly, the dimensions ofthe various features may be arbitrarily expanded or reduced for clarity.In addition, some of the drawings may not depict all of the componentsof a given system, method or device. Finally, like reference numeralsmay be used to denote like features throughout the specification andfigures.

DETAILED DESCRIPTION

Numerous details are described herein in order to provide a thoroughunderstanding of the example embodiments illustrated in the accompanyingdrawings. However, some embodiments may be practiced without many of thespecific details, and the scope of the claims is only limited by thosefeatures and aspects specifically recited in the claims. Furthermore,well-known processes, components, and materials have not been describedin exhaustive detail so as not to unnecessarily obscure pertinentaspects of the embodiments described herein.

A microstrip antenna is described herein, which address the shortcomingsdescribed above in conventional charging systems and with existingantenna designs. In some embodiments, the microstrip antenna describedherein is a component of a transmitter and/or a receiver of a wirelesspower transmission environment 100 (e.g., as described with regard toFIG. 1). For example, a microstrip antenna transmits power waves and/orreceives transmitted power waves.

In some embodiments, one or more transmitters of a wireless powertransmission environment generate power waves to form pockets of energyat target locations and adjust power wave generation based on senseddata to provide safe, reliable, and efficient wirelessly-delivered powerto receivers (and devices associated therewith). In some embodiments, acontrolled “pocket of energy” (e.g., a region in which available poweris high due to constructive interference of power waves) and/or nullspaces (e.g., a region in which available power is low or nonexistentdue to destructive interference of power waves) may be formed byconvergence of the power waves transmitted into a transmission field ofthe one or more transmitters. In some embodiments, the one or moretransmitters include an array of the microstrip antennas describedherein (e.g., in reference to FIGS. 2-7C), and the array of themicrostrip antennas is used to transmit the power waves. For example,the antennas discussed herein may be integrated with consumer devicessuch as sound bars, televisions, media entertainment systems, lightfixtures, and other consumer devices, to produce a respectivetransmitter that remains aesthetically appealing, yet still capable oftransmitting power waves sufficient to charge other electronic devices(e.g., cell phones, smart watches, etc.).

In some embodiments, pockets of energy form at one or more locations ina two- or three-dimensional field due to patterns of constructiveinterference caused by convergences of transmitted power waves. Energyfrom the transmitted power waves may be harvested by receivers (i.e.,received and converted into usable power) at the one or more locations.

In some embodiments, adaptive pocket-forming is performed, e.g., byadjusting power wave transmission to achieve a target power level for atleast some of the power waves transmitted by the one or moretransmitters. For example, a system for adaptive pocket-forming includesa sensor. In some embodiments, when the sensor detects an object, suchas a sensitive object (e.g., a person, an animal, equipment sensitive tothe power waves, and the like) within a predetermined distance (e.g., adistance within a range of 1-5 feet) of a pocket of energy, of one ormore of the power waves, or of a transmitter, then a respectivetransmitter of the one or more transmitters adjusts one or morecharacteristics of transmitted power waves. Non-limiting examples of theone or more characteristics include: frequency, amplitude, trajectory,phase, and other characteristics used by one or more antennas of the oneor more transmitters to transmit the power waves. As one example, inresponse to receiving information indicating that transmission of powerwaves by a respective transmitter of the one or more transmitters shouldbe adjusted (e.g., a sensor senses a sensitive object within apredetermined distance of a respective target location), the adaptivepocket-forming process adjusts the one or more characteristicsaccordingly.

In some embodiments, adjusting the one or more characteristics includesreducing a currently generated power level at a location by adjustingone or more transmitted power waves that converge at the targetlocation. In some embodiments, reducing a currently generated powerlevel includes transmitting a power wave that causes destructiveinterference with at least one other transmitted power wave. Forexample, a power wave is transmitted with a first phase that is shiftedrelative to a second phase of at least one other power wave todestructively interfere with the at least one other power wave in orderto diminish or eliminate the currently generated power level at thetarget location.

In some embodiments, adjusting the one or more characteristics includesincreasing a power level for some of the transmitted power waves toensure that the receiver receives adequate energy sufficient to quicklycharge a power-storing component of an electronic device that isassociated with the receiver.

In some embodiments, an object is “tagged” (e.g., an identifier of theobject is stored in memory in association with a flag) to indicate thatthe detected object is a sensitive object. In response to detection of aparticular object within a predetermined distance of a target location,a determination is made as to whether the particular object is asensitive object. In some embodiments, this determination includesperforming a lookup in the memory to check whether the particular objecthas been previously tagged and is therefore known as a sensitive object.In response to determining that the particular object is a sensitiveobject, the one or more characteristics used to transmit the power wavesare adjusted accordingly.

In some embodiments, sensing a sensitive object includes using a seriesof sensor readings from one or more sensors to determine motion of anobject within a transmission field of the one or more transmitters. Insome embodiments, sensor output from one or more sensors is used todetect motion of the object approaching within a predetermined distanceof a pocket of energy or of power waves used to form the pocket ofenergy. In response to a determination that a sensitive object isapproaching (e.g., moving toward and/or within a predefined distance ofa pocket of energy), the currently generated power level at the locationof the pocket of energy is reduced. In some embodiments, the one or moresensors include sensors that are internal to the one or moretransmitters and/or the receiver. In some embodiments, the one or moresensors include sensors that are external to the one or moretransmitters and the receiver. In some embodiments, the one or moresensors include thermal imaging, optical, radar, and other types ofsensors capable of detecting objects within a transmission field.

Although some embodiments herein include the use of RF-based wavetransmission technologies as a primary example, it should be appreciatedthat the wireless charging techniques that might be employed are not belimited to RF-based technologies and transmission techniques. Rather, itshould be appreciated that additional or alternative wireless chargingtechniques may be utilized, including any suitable technology andtechnique for wirelessly transmitting energy so that a receiver iscapable of converting the transmitted energy to electrical power. Suchtechnologies or techniques may transmit various forms of wirelesslytransmitted energy including the following non-limiting examples:ultrasound, microwave, laser light, infrared, or other forms ofelectromagnetic energy.

FIG. 1 is a block diagram of components of wireless power transmissionenvironment 100, in accordance with some embodiments. Wireless powertransmission environment 100 includes, for example, transmitters 102(e.g., transmitters 102 a, 102 b . . . 102 n) and one or more receivers120 (e.g., receivers 120 a, 120 b . . . 120 n). In some embodiments,each respective wireless power transmission environment 100 includes anumber of receivers 120, each of which is associated with a respectiveelectronic device 122.

An example transmitter 102 (e.g., transmitter 102 a) includes, forexample, one or more processor(s) 104, a memory 106, one or more antennaarrays 110 (e.g., including antenna elements structured as describedbelow in reference to FIGS. 2-7C), and one or more communicationscomponents 112, and/or one or more transmitter sensors 114. In someembodiments, these components are interconnected by way of acommunications bus 108. References to these components of transmitters102 cover embodiments in which one or more than one of each of thesecomponents (and combinations thereof) are included.

In some embodiments, memory 106 stores one or more programs (e.g., setsof instructions) and/or data structures, collectively referred to as“modules” herein. In some embodiments, memory 106, or the non-transitorycomputer readable storage medium of memory 106 stores the followingmodules 107 (e.g., programs and/or data structures), or a subset orsuperset thereof:

-   -   information received from receiver 120 (e.g., generated by        receiver sensor 128 and then transmitted to the transmitter 102        a);    -   information received from transmitter sensor 114;    -   an adaptive pocket-forming module that adjusts one or more power        waves transmitted by one or more transmitters 102; and/or    -   a beacon transmitting module that transmits a communication        signal 118 for detecting a receiver 120 (e.g., within a        transmission field of the one or more transmitters 102).

The above-identified modules (e.g., data structures and/or programsincluding sets of instructions) need not be implemented as separatesoftware programs, procedures, or modules, and thus various subsets ofthese modules may be combined or otherwise re-arranged in variousembodiments. In some embodiments, memory 106 stores a subset of themodules identified above. In some embodiments, an external mappingmemory 131 that is communicatively connected to communications component112 stores one or more modules identified above. Furthermore, the memory106 and/or external mapping memory 131 may store additional modules notdescribed above. In some embodiments, the modules stored in memory 106,or a non-transitory computer readable storage medium of memory 106,provide instructions for implementing respective operations in themethods described below. In some embodiments, some or all of thesemodules may be implemented with specialized hardware circuits thatsubsume part or all of the module functionality. One or more of theabove-identified elements may be executed by one or more of processor(s)104. In some embodiments, one or more of the modules described withregard to memory 106 is implemented on memory 104 of a server (notshown) that is communicatively coupled to one or more transmitters 102and/or by a memory of electronic device 122 and/or receiver 120.

In some embodiments, a single processor 104 (e.g., processor 104 oftransmitter 102 a) executes software modules for controlling multipletransmitters 102 (e.g., transmitters 102 b . . . 102 n). In someembodiments, a single transmitter 102 (e.g., transmitter 102 a) includesmultiple processors 104, such as one or more transmitter processors(configured to, e.g., control transmission of signals 116 by antennaarray 110), one or more communications component processors (configuredto, e.g., control communications transmitted by communications component112 and/or receive communications by way of communications component112) and/or one or more sensor processors (configured to, e.g., controloperation of transmitter sensor 114 and/or receive output fromtransmitter sensor 114).

Receiver 120 (e.g., a receiver of electronic device 122) receives powersignals 116 and/or communications 118 transmitted by transmitters 102.In some embodiments, receiver 120 includes one or more antennas 124(e.g., antenna array including multiple antenna elements), powerconverter 126, receiver sensor 128 and/or other components or circuitry(e.g., processor(s) 140, memory 142, and/or communication component(s)144). In some embodiments, these components are interconnected by way ofa communications bus 143. References to these components of receiver 120cover embodiments in which one or more than one of each of thesecomponents (and combinations thereof) are included. Receiver 120converts energy from received signals 116 (e.g., power waves) intoelectrical energy to power and/or charge electronic device 122. Forexample, receiver 120 uses power converter 126 to convert capturedenergy from power waves 116 to alternating current (AC) electricity ordirect current (DC) electricity usable to power and/or charge electronicdevice 122. Non-limiting examples of power converter 126 includerectifiers, rectifying circuits, voltage conditioners, among suitablecircuitry and devices.

In some embodiments, receiver 120 is a standalone device that isdetachably coupled to one or more electronic devices 122. For example,electronic device 122 has processor(s) 132 for controlling one or morefunctions of electronic device 122 and receiver 120 has processor(s) 140for controlling one or more functions of receiver 120.

In some embodiments, receiver is a component of electronic device 122.For example, processor(s) 132 controls functions of electronic device122 and receiver 120.

In some embodiments, electronic device 122 includes processor(s) 132,memory 134, communication component(s) 136, and/or battery/batteries130. In some embodiments, these components are interconnected by way ofa communications bus 138. In some embodiments, communications betweenelectronic device 122 and receiver 120 occur via communicationscomponent(s) 136 and/or 144. In some embodiments, communications betweenelectronic device 122 and receiver 120 occur via a wired connectionbetween communications bus 138 and communications bus 146. In someembodiments, electronic device 122 and receiver 120 share a singlecommunications bus.

In some embodiments, receiver 120 receives one or more power waves 116directly from transmitter 102. In some embodiments, receiver 120harvests power waves from one or more pockets of energy created by oneor more power waves 116 transmitted by transmitter 102.

In some embodiments, after the power waves 116 are received and/orenergy is harvested from a pocket of energy, circuitry (e.g., integratedcircuits, amplifiers, rectifiers, and/or voltage conditioner) of thereceiver 120 converts the energy of the power waves (e.g., radiofrequency electromagnetic radiation) to usable power (i.e.,electricity), which powers electronic device 122 and/or is stored tobattery 130 of electronic device 122. In some embodiments, a rectifyingcircuit of the receiver 120 translates the electrical energy from AC toDC for use by electronic device 122. In some embodiments, a voltageconditioning circuit increases or decreases the voltage of theelectrical energy as required by the electronic device 122. In someembodiments, an electrical relay conveys electrical energy from thereceiver 120 to the electronic device 122.

In some embodiments, receiver 120 is a component of an electronic device122. In some embodiments, a receiver 120 is coupled (e.g., detachablycoupled) to an electronic device 122. In some embodiments, electronicdevice 122 is a peripheral device of receiver 120. In some embodiments,electronic device 122 obtains power from multiple transmitters 102and/or using multiple receivers 120. In some embodiments, the wirelesspower transmission environment 100 includes a plurality of electronicdevices 122, each having at least one respective receiver 120 that isused to harvest power waves from the transmitters 102 into usable powerfor charging the electronic devices 122.

In some embodiments, the one or more transmitters 102 adjust one or morecharacteristics (e.g., phase, gain, direction, and/or frequency) ofpower waves 116. For example, a transmitter 102 (e.g., transmitter 102a) selects a subset of one or more antenna elements of antenna array 110to initiate transmission of power waves 116, cease transmission of powerwaves 116, and/or adjust one or more characteristics used to transmitpower waves 116. In some implementations, the one or more transmitters102 adjust power waves 116 such that trajectories of power waves 116converge at a predetermined location within a transmission field (e.g.,a location or region in space), resulting in controlled constructive ordestructive interference patterns.

In some embodiments, respective antenna arrays 110 of the one or moretransmitters 102 may include a set of one or more antennas configured totransmit the power waves 116 into respective transmission fields of theone or more transmitters 102. Integrated circuits (not shown) of therespective transmitter 102, such as a controller circuit and/or waveformgenerator, may control the behavior of the antennas. For example, basedon the information received from the receiver by way of thecommunications signal 118, a controller circuit may determine a set ofone or more characteristics or waveform characteristics (e.g.,amplitude, frequency, trajectory, phase, among other characteristics)used for transmitting the power waves 116 that would effectively providepower to the receiver 102 and electronic device 122. The controllercircuit may also identify a subset of antennas from the antenna arrays110 that would be effective in transmitting the power waves 116. Asanother example, a waveform generator circuit of the respectivetransmitter 102 coupled to the processor 104 may convert energy andgenerate the power waves 116 having the waveform characteristicsidentified by the controller, and then provide the power waves to theantenna arrays 110 for transmission.

In some embodiments, constructive interference of power waves occurswhen two or more power waves 116 are in phase with each other andconverge into a combined wave such that an amplitude of the combinedwave is greater than amplitude of a single one of the power waves. Forexample, the positive and negative peaks of sinusoidal waveformsarriving at a location from multiple antennas “add together” to createlarger positive and negative peaks. In some embodiments, a pocket ofenergy is formed at a location in a transmission field whereconstructive interference of power waves occurs.

In some embodiments, destructive interference of power waves occurs whentwo or more power waves are out of phase and converge into a combinedwave such that the amplitude of the combined wave is less than theamplitude of a single one of the power waves. For example, the powerwaves “cancel each other out,” thereby diminishing the amount of energyconcentrated at a location in the transmission field. In someembodiments, destructive interference is used to generate a negligibleamount of energy or “null” at a location within the transmission fieldwhere the power waves converge.

In some embodiments, the one or more transmitters 102 transmit powerwaves 116 that create two or more discrete transmission fields (e.g.,overlapping and/or non-overlapping discrete transmission fields). Insome embodiments, a first transmission field is managed by a firstprocessor 104 of a first transmitter (e.g. transmitter 102 a) and asecond transmission field is managed by a second processor 104 of asecond transmitter (e.g., transmitter 102 b). In some embodiments, thetwo or more discrete transmission fields (e.g., overlapping and/ornon-overlapping) are managed by the transmitter processors 104 as asingle transmission field.

In some embodiments, communications component 112 transmitscommunication signals 118 by way of a wired and/or wirelesscommunication connection to receiver 120. In some embodiments,communications component 112 generates communications signals 118 usedfor triangulation of receiver 120. In some embodiments, communicationsignals 118 are used to convey information between transmitter 102 andreceiver 120 for adjusting one or more characteristics used to transmitthe power waves 116. In some embodiments, communications signals 118include information related to status, efficiency, user data, powerconsumption, billing, geo-location, and other types of information.

In some embodiments, receiver 120 includes a transmitter (not shown), oris a part of a transceiver, that transmits communications signals 118 tocommunications component 112 of transmitter 102.

In some embodiments, communications component 112 (e.g., communicationscomponent 112 of transmitter 102 a) includes a communications componentantenna for communicating with receiver 120 and/or other transmitters102 (e.g., transmitters 102 b through 102 n). In some embodiments, thesecommunications signals 118 represent a distinct channel of signalstransmitted by transmitter 102, independent from a channel of signalsused for transmission of the power waves 116.

In some embodiments, the receiver 120 includes a receiver-sidecommunications component (not shown) configured to communicate varioustypes of data with one or more of the transmitters 102, through arespective communications signal 118 generated by the receiver-sidecommunications component. The data may include location indicators forthe receiver 102 and/or electronic device 122, a power status of thedevice 122, status information for the receiver 102, status informationfor the electronic device 122, status information about the power waves116, and/or status information for pockets of energy. In other words,the receiver 102 may provide data to the transmitter 102, by way of thecommunications signal 118, regarding the current operation of the system100, including: information identifying a present location of thereceiver 102 or the device 122, an amount of energy received by thereceiver 120, and an amount of power received and/or used by theelectronic device 122, among other possible data points containing othertypes of information.

In some embodiments, the data contained within communications signals118 is used by electronic device 122, receiver 120, and/or transmitters102 for determining adjustments of the one or more characteristics usedby the antenna array 110 to transmit the power waves 106. Using acommunications signal 118, the transmitter 102 communicates data that isused, e.g., to identify receivers 120 within a transmission field,identify electronic devices 122, determine safe and effective waveformcharacteristics for power waves, and/or hone the placement of pockets ofenergy. In some embodiments, receiver 120 uses a communications signal118 to communicate data for, e.g., alerting transmitters 102 that thereceiver 120 has entered or is about to enter a transmission field,provide information about electronic device 122, provide userinformation that corresponds to electronic device 122, indicate theeffectiveness of received power waves 116, and/or provide updatedcharacteristics or transmission parameters that the one or moretransmitters 102 use to adjust transmission of the power waves 116.

As an example, the communications component 112 of the transmitter 102communicates (e.g., transmits and/or receives) one or more types of data(including, e.g., authentication data and/or transmission parameters)including various information such as a beacon message, a transmitteridentifier, a device identifier for an electronic device 122, a useridentifier, a charge level for electronic device 122, a location ofreceiver 120 in a transmission field, and/or a location of electronicdevice 122 in a transmission field.

In some embodiments, transmitter sensor 114 and/or receiver sensor 128detect and/or identify conditions of electronic device 122, receiver120, transmitter 102, and/or a transmission field. In some embodiments,data generated by transmitter sensor 114 and/or receiver sensor 128 isused by transmitter 102 to determine appropriate adjustments to the oneor more characteristics used to transmit the power waves 106. Data fromtransmitter sensor 114 and/or receiver sensor 128 received bytransmitter 102 includes, e.g., raw sensor data and/or sensor dataprocessed by a processor 104, such as a sensor processor. Processedsensor data includes, e.g., determinations based upon sensor dataoutput. In some embodiments, sensor data received from sensors that areexternal to the receiver 120 and the transmitters 102 is also used (suchas thermal imaging data, information from optical sensors, and others).

In some embodiments, receiver sensor 128 is a gyroscope that providesraw data such as orientation data (e.g., tri-axial orientation data),and processing this raw data may include determining a location ofreceiver 120 and/or or a location of receiver antenna 124 using theorientation data.

In some embodiments, receiver sensor 128 includes one or more infraredsensors (e.g., that output thermal imaging information), and processingthis infrared sensor data includes identifying a person (e.g.,indicating presence of the person and/or indicating an identification ofthe person) or other sensitive object based upon the thermal imaginginformation.

In some embodiments, receiver sensor 128 includes a gyroscope and/or anaccelerometer that indicates an orientation of receiver 120 and/orelectronic device 122. As one example, transmitters 102 receiveorientation information from receiver sensor 128 and the transmitters102 (or a component thereof, such as the processor 104) use the receivedorientation information to determine whether electronic device 122 isflat on a table, in motion, and/or in use (e.g., next to a user's head).

In some embodiments, receiver sensor 128 is a sensor of electronicdevice 122 (e.g., an electronic device 122 that is remote from receiver102). In some embodiments, receiver 120 and/or electronic device 122includes a communication system for transmitting signals (e.g., sensorsignals output by receiver sensor 128) to transmitter 102.

Non-limiting examples of transmitter sensor 114 and/or receiver sensor128 include, e.g., infrared, pyroelectric, ultrasonic, laser, optical,Doppler, gyro, accelerometer, microwave, millimeter, RF standing-wavesensors, resonant LC sensors, capacitive sensors, and/or inductivesensors. In some embodiments, technologies for transmitter sensor 114and/or receiver sensor 128 include binary sensors that acquirestereoscopic sensor data, such as the location of a human or othersensitive object.

In some embodiments, transmitter sensor 114 and/or receiver sensor 128is configured for human recognition (e.g., capable of distinguishingbetween a person and other objects, such as furniture). Examples ofsensor data output by human recognition-enabled sensors include: bodytemperature data, infrared range-finder data, motion data, activityrecognition data, silhouette detection and recognition data, gesturedata, heart rate data, portable devices data, and wearable device data(e.g., biometric readings and output, accelerometer data).

In some embodiments, transmitters 102 adjust one or more characteristicsused to transmit the power waves 116 to ensure compliance withelectromagnetic field (EMF) exposure protection standards for humansubjects. Maximum exposure limits are defined by US and Europeanstandards in terms of power density limits and electric field limits (aswell as magnetic field limits). These include, for example, limitsestablished by the Federal Communications Commission (FCC) for maximumpermissible exposure (MPE), and limits established by Europeanregulators for radiation exposure. Limits established by the FCC for MPEare codified at 47 CFR § 1.1310. For electromagnetic field (EMF)frequencies in the microwave range, power density can be used to expressan intensity of exposure. Power density is defined as power per unitarea. For example, power density can be commonly expressed in terms ofwatts per square meter (W/m²), milliwatts per square centimeter(mW/cm²), or microwatts per square centimeter (μW/cm²). In someembodiments, output from transmitter sensor 114 and/or receiver sensor128 is used by transmitter 102 to detect whether a person or othersensitive object enters a power transmission region (e.g., a locationwithin a predetermined distance of a transmitter 102, power wavesgenerated by transmitter 102, and/or a pocket of energy). In someembodiments, in response to detecting that a person or other sensitiveobject has entered the power transmission region, the transmitter 102adjusts one or more power waves 116 (e.g., by ceasing power wavetransmission, reducing power wave transmission, and/or adjusting the oneor more characteristics of the power waves). In some embodiments, inresponse to detecting that a person or other sensitive object hasentered the power transmission region, the transmitter 102 activates analarm (e.g., by transmitting a signal to a loudspeaker that is acomponent of transmitter 102 or to an alarm device that is remote fromtransmitter 102). In some embodiments, in response to detecting that aperson or other sensitive object has entered a power transmissionregion, the transmitter 102 transmits a digital message to a system logor administrative computing device.

In some embodiments, antenna array 110 includes multiple antennaelements (e.g., configurable “tiles”) collectively forming an antennaarray. Antenna array 110 generates power transmission signals, e.g., RFpower waves, ultrasonic power waves, infrared power waves, and/ormagnetic resonance power waves. In some embodiments, the antennas of anantenna array 110 (e.g., of a single transmitter, such as transmitter102 a, and/or of multiple transmitters, such as transmitters 102 a, 102b, . . . , 102 n) transmit two or more power waves that intersect at adefined location (e.g., a location corresponding to a detected locationof a receiver 120), thereby forming a pocket of energy (e.g., aconcentration of energy) at the defined location.

In some embodiments, transmitter 102 assigns a first task to a firstsubset of antenna elements of antenna array 110, a second task to asecond subset of antenna elements of antenna array 110, and so on, suchthat the constituent antennas of antenna array 110 perform differenttasks (e.g., determining locations of previously undetected receivers120 and/or transmitting power waves 116 to one or more receivers 120).As one example, in an antenna array 110 with ten antennas, nine antennastransmit power waves 116 that form a pocket of energy and the tenthantenna operates in conjunction with communications component 112 toidentify new receivers in the transmission field. In another example, anantenna array 110 having ten antenna elements is split into two groupsof five antenna elements, each of which transmits power waves 116 to twodifferent receivers 120 in the transmission field.

In some embodiments, a microstrip antenna 200 (of FIG. 2) is an antennaelement of antenna array 110 of transmitter 102. In some embodiments, amicrostrip antenna 200 is an antenna element of antenna 124 of receiver120. Microstrip antenna 200 transmits and/or receives electromagneticwaves.

FIG. 2 illustrates a cross-sectional view of a microstrip antenna 200,in accordance with some embodiments. In some embodiments, the microstripantenna 200 includes a first multi-layer printed circuit board (PCB)202, a second multi-layer PCB 204, and a dielectric slab 206. In someembodiments, the first multi-layer PCB 202 includes first PCB 208. Insome embodiments, the first PCB 208 includes electrically conductivematerial at the top side of first PCB 208 (e.g., a first layer 210 ofthe electrically conductive material) and at the bottom side of firstPCB 208 (e.g., a second layer 212 of the electrically conductivematerial). In some embodiments, the second multi-layer PCB 204 includessecond PCB 214. In some embodiments, the second PCB 214 includeselectrically conductive material at the top side of second PCB 214(e.g., a first layer 216 of the electrically conductive material) and atthe bottom side of second PCB 214 (e.g., a second layer 218 of theelectrically conductive material). In some embodiments, the electricallyconductive material is a metal, for example, copper, silver, gold,aluminum, and/or brass. In some embodiments, the electrically conductivematerial is laminated on tops and/or bottoms of the PCBs 208 and 214during manufacture of the first multi-layer PCB 202 and the secondmulti-layer PCB 204.

In some embodiments, a first set of vias 220 each pass through the firstmulti-layer PCB 202. In some embodiments, a second set of vias 222 eachpass through the second multi-layer PCB 204.

In some embodiments, a first feed 224 passes at least partially throughsecond multi-layer PCB 204, dielectric slab 206, and first multi-layerPCB 202. In some embodiments, a second feed 226 passes at leastpartially through second multi-layer PCB 204, dielectric slab 206, andfirst multi-layer PCB 202. For example, a microstrip antenna 200 that isa dual-polarized antenna includes two feeds (e.g., first feed 224 totransmit and/or receive horizontally polarized waves and second feed 226to transmit and/or receive vertically polarized waves). In someembodiments, a microstrip antenna 200 that is a single-polarized antennaincludes only a single feed (e.g., first feed 224). First feed 224 andsecond feed 226 are, for example, metallic pins.

In some embodiments, a first signal (e.g., a first RF power wave) isprovided to first feed 224 via a first cable 228. In some embodiments,first feed 224 excites the microstrip antenna 200 using the first signalfor transmission of RF power waves by the microstrip antenna 200. Insome embodiments, a second signal (e.g., a second RF power wave) isprovided to second feed 226 via a second cable 230. In some embodiments,second feed 226 excites the microstrip antenna 200 using the secondsignal for transmission of RF power waves by the microstrip antenna 200.In some embodiments, first cable 228 and/or second cable 230 are coupledto an output of processor(s) 104 of transmitter 102 a (processor(s) 102and transmitter 102 a are discussed in detail above in reference to FIG.1).

Having a single microstrip antenna with two multi-layer PCBs at oppositeends of a dielectric slab helps to improve manufacturability ofantennas. For example, in some embodiments, electrically conductivematerial is printed on PCBs 208 and 214 using established PCB printingtechniques. In some embodiments, any desired slab of material is usableas a substrate (e.g., dielectric substrate 206) to which multi-layerPCBs are attached.

FIG. 3 illustrates a top view of a first multi-layer PCB 202, inaccordance with some embodiments. An electrically conductive material(e.g., layer 210) is shown at the top of first PCB 208. FIG. 3illustrates an embodiment in which first feed 224 and second feed 226partially puncture first PCB 208, causing distortion of the top surfaceof first PCB 208. Distortion regions 302 and 304 show locations of firstfeed 224 and second feed 226, respectively, within the first multi-layerPCB 202.

A first set of vias 220 pass through the first multi-layer PCB 202. Insome embodiments, a y-axis distance 306 between vias of the plurality ofvias 220 and/or an x-axis distance 308 between vias of the plurality ofvias 220 is much smaller than a wavelength λ that corresponds to atarget frequency (e.g., 900 MHz) for transmission and/or reception bymicrostrip antenna 200. Additionally, the microstrip antenna 200 (ofwhich PCB 202 is a component) also has a maximum cross-sectionaldimension which is much smaller than this wavelength (as discussed belowin reference to FIG. 4). For example, in some embodiments, y-axisdistance 306 and/or x-axis distance 308 (or the maximum cross-sectionaldimension of the microstrip antenna 200) is equal to or less than λ/0(e.g., λ/20). In some embodiments, y-axis distance 306 and/or x-axisdistance 308 is 2.0 mm. In some embodiments, a diameter of a respectivevia of the plurality of vias 220 is less than or equal to 2.0 mm (e.g.,1.0 mm).

FIG. 4 illustrates an x-axis dimension 402 and a y-axis dimension 404 ofmicrostrip antenna 200, in accordance with some embodiments. In someembodiments, one or more dimensions of microstrip antenna 200 aredetermined based on a target bandwidth. For example, in someembodiments, x-axis dimension 402 and/or y-axis dimension 404 is/aremuch smaller than a wavelength λ that corresponds to a target frequency(e.g., 900 MHz) of power waves transmitted by the microstrip antenna200. In some embodiments, the microstrip antenna 200 has an x-axisdimension 402 of less than or equal to 50.8 mm (e.g., 40 mm). In someembodiments, the microstrip antenna 200 has a y-axis dimension 404 ofless than or equal to 50.8 mm (e.g., 30 mm). For example, in someembodiments, the microstrip antenna 200 has an x-axis dimension 402 of25.4 mm and a y-axis dimension 404 of 25.4 mm.

FIG. 5 is an expanded cross-sectional view of first multi-layer PCB 202that illustrates a material formed on an interior surface of at least asubset of vias of the plurality of vias 220, in accordance with someembodiments. In some embodiments, a via-coating material (e.g.,via-coating material 502 and 504) is formed on an interior surface ofone or more vias (e.g., an interior surface of each via) of theplurality of vias 220. For example, the interior surface of one or morevias is plated with the via-coating material. In some embodiments, thevia-coating material is a heat-conducting material and/or anelectrically-conductive material. In some embodiments, the via-coatingmaterial is conductively coupled to a first electrically conductivematerial (e.g., electrically conductive material 210 as shown at the topof first PCB 208 and/or electrically conductive material 212 as shown atthe bottom of first PCB 208). For example, the via-coating material isconductively coupled to a first electrically conductive material suchthat heat and/or electrons are conducted between electrically conductivelayer 210, the via-coating material, and electrically conductive layer212. In some embodiments, via-coating material is conductively coupledto a second electrically conductive material (e.g., electricallyconductive material 216 as shown at the top of second PCB 214 and/orelectrically conductive material 218 as shown at the bottom of secondPCB 214). In some embodiments, the via-coating material and theelectrically conductive material (e.g., first electrically conductivematerial and/or second electrically conductive material) are the samematerial.

FIG. 6 illustrates an array 600 of microstrip antennas, in accordancewith some embodiments. In some embodiments, array 600 is used as anantenna array 110 of a transmitter 102 within a wireless powertransmission environment 100 as illustrated in FIG. 1 and describedabove. Array 600 includes a plurality of component antennas, such asmultiple microstrip antennas 200 (e.g., first microstrip antenna 200 a,second microstrip antenna 200 b, and third microstrip antenna 200 c).Although three microstrip antennas are shown in FIG. 6, it will berecognized that other numbers of antennas may be included in array 600,e.g., 2-10 antennas.

In some embodiments, formation of array 600 includes arranging therespective multi-layer PCBs of microstrip antennas 200 a, 200 b, and 200c, and forming a single dielectric slab 206 relative to the respectivemulti-layer PCBs. For example, the respective multi-layer PCBs areexposed to a liquid state of the dielectric material and a dielectricslab is formed when the dielectric material transitions from a liquidstate to a solid state. In other words, the dielectric slab 206 isformed around the respective multi-layer PCBs.

In some embodiments, formation of array 600 includes attachingrespective multi-layer PCBs of microstrip antennas 200 a, 200 b, and 200c to a dielectric slab 206 using an adhesive or other mechanicalrestraint.

In some embodiments, transmission of RF waves by array 600 is controlledby a plurality of control elements (not shown). In some embodiments, arespective control element of the plurality of control elements includesone or more feeds. For example, a first control element controls firstfeed 224 and/or second feed 226. In some embodiments, a first controlelement causes microstrip antenna 200 a to transmit a first RF signal, asecond control element causes microstrip antenna 200 b to transmit asecond RF signal, and a third control element causes microstrip antenna200 c to transmit a third RF signal. In some embodiments, the first RFsignal is transmitted with at least one characteristic that is distinctfrom a corresponding characteristic associated with the second RF signaland/or the third RF signal. In some embodiments, the control elementsreceive signals from processor(s) 104 of transmitter 102. For example, acontrol element includes an output terminal of processor(s) 104 and/or acommunication channel from processor(s) 104 to a microstrip antenna 200.

Although a horizontal arrangement of microstrip antennas 200 a, 200 b,and 200 c is shown in FIG. 6, it will be recognized that alternativearrangements may be used, such as a vertical arrangement of microstripantennas 200 and/or a grid arrangement of microstrip antennas 200.

In some embodiments, multiple antenna arrays 600 may be included in arespective transmitter 102 and each of the multiple antenna arrays maybe configured to transmit power waves at different frequencies (e.g., afirst antenna array may be configured to transmit at 900 MHz and asecond antenna array may be configured to transmit at 2.4 GHz). To allowfor transmission at the different frequencies, each of the multipleantenna arrays may have antennas that are of different dimensions orshapes (e.g., the first antenna array may include larger antennas thanthe second antenna array).

FIGS. 7A-7C are a flowchart representation of a method 700 for formingan antenna, in accordance with some embodiments.

In some embodiments, forming an antenna optionally includes forming(702-a) a first multi-layer PCB 202 and forming (702-b) a secondmulti-layer PCB 204. In some embodiments, forming the first multi-layerPCB 202 includes printing a first electrically conductive layer on thetop and bottom surfaces of the first multi-layer PCB (e.g., printing theelectrically conductive layer as shown at top surface 210 and bottomsurface 212 of first PCB 208, FIG. 2). In some embodiments, forming thesecond multi-layer PCB 204 includes printing the second electricallyconductive layer on the top and bottom surfaces of the secondmulti-layer PCB (e.g., printing the electrically conductive layer asshown at top surface 216 and bottom surface 218 of second PCB 214, FIG.2).

In some embodiments, forming a multi-layer PCB includes coupling anelectrically conductive material (e.g., copper tape or other conductivematerial) to a substrate (e.g., PCB) by lamination (e.g., using anadhesive such as glue). In some embodiments, a multi-layer PCB is formedusing a holding structure such as one or more notches and/or tabs suchthat an electrically conductive material is physically held in placerelative to a substrate by the holding structure.

In some embodiments, forming the first multi-layer PCB 202 optionallyincludes depositing (704-a) a first heat-conductive material on aninterior surface of at least a subset of the first plurality of vias220. In some embodiments, forming the second multi-layer PCB 204optionally includes depositing (704-b) a second heat-conductive materialon an interior surface of at least a subset of the second plurality ofvias 222. For example, a first heat-conductive material is deposited onan interior surface of one or more vias as shown at 502 and 504 of FIG.5.

In some embodiments, depositing a first heat-conductive material on aninterior surface of at least a subset of the first plurality of vias 220includes depositing (706-a) the first heat-conductive material such thatthe first heat-conductive material (e.g., as shown at 502 and 504 ofFIG. 5) is thermally coupled to the first electrically conductivematerial (e.g., as shown at 210 and 212 of FIG. 2) of the firstmulti-layer PCB 202. In some embodiments, depositing a secondheat-conductive material on an interior surface of at least a subset ofthe second plurality of vias includes depositing (706-b) the secondheat-conductive material such that the second heat-conductive materialis thermally coupled to the second electrically conductive material(e.g., as shown at 216 and 218 of FIG. 2) of the second multi-layer PCB204. In some embodiments, the heat-conducting material is a metal suchas copper, aluminum, brass, steel, and/or bronze.

Turning now to FIG. 7B, in some embodiments, forming an antenna includesforming (708) a dielectric assembly by coupling a dielectric slab 206 toa first multi-layer PCB 202 and a second multi-layer PCB 204. The firstmulti-layer PCB 202 includes (708-a) a top surface and a bottom surfacethat is opposite the top surface. The top and bottom surfaces of thefirst multi-layer PCB 202 include a first electrically conductivematerial (e.g., as shown at 210 and 212 of FIG. 2). A first plurality ofvias 220 each substantially pass through the top and bottom surfaces ofthe first multi-layer PCB 202. The second multi-layer PCB 204 includes(708-b) a top surface and a bottom surface that is opposite the topsurface. The top and bottom surfaces of the second multi-layer PCT 204include a second electrically conductive material (e.g., as shown at 216and 218 of FIG. 2). A second plurality of vias 222 each substantiallypass through the top and bottom surfaces of the second multi-layer PCB204.

In some embodiments, dielectric slab 206 includes a dielectric materialfabricated from an exotic and/or synthetic material, such as a materialthat has a high dielectric constant (e.g., a moldable ceramic). Forexample, in some embodiments, dielectric slab 206 has a dielectricconstant between 1.0 and 40 (e.g., a dielectric constant of 30). In someembodiments, the dielectric slab 206 is formed from stone, ceramic,plastic, and/or glass, or gas (e.g., in a container). In someembodiments, dielectric slab 206 is fabricated from a material that iscapable of insulating, reflecting, and/or absorbing electric current. Insome embodiments, dielectric slab 206 is fabricated from one or morematerials that are engineered to yield predetermined magneticpermeability and/or electrical permittivity values. In some embodiments,at least one of a magnetic permeability value or an electricalpermittivity value of dielectric slab 206 is based upon at least onepredetermined power-transfer requirement and/or compliance constraint(e.g., in compliance with one or more government regulations).

In some embodiments, coupling the dielectric slab 206 to the firstmulti-layer PCB 202 and the second multi-layer PCB 204 optionallyincludes (710) coupling the first multi-layer PCB 202 to the dielectricslab 206 using an adhesive (e.g., glue, epoxy, potting compound, orother suitable adhesive) and coupling the second multi-layer PCB 204 tothe dielectric slab 206 using the adhesive.

In some embodiments, coupling the dielectric slab 206 to the firstmulti-layer PCB 202 and the second multi-layer PCB 204 optionallyincludes (712) arranging the first multi-layer PCB 202 and the secondmulti-layer PCB 204 relative to dielectric material while it is in aliquid state, wherein the first multi-layer PCB 202 and the secondmulti-layer PCB 204 have fixed positions within the dielectric slab 206after the dielectric material of the dielectric slab 206 transitionsfrom the liquid state to a solid state. For example, the dielectricmaterial of dielectric slab 206 is a ceramic, plastic, or otherstate-changing material that is capable of transitioning from a liquidstate to a set solid state. In some embodiments, the first multi-layerPCB 202 and the second multi-layer PCB 204 are coupled to the dielectricslab 206 by molding the dielectric material around the first multi-layerPCB 202 and the second multi-layer PCB 204. For example, the dielectricslab 206 is shaped to include two reservoirs that are configured toreceive the first and second multi-layer PCBs and the dielectric slab206 is then baked so that the first and second multi-layer PCBs are thensecurely attached within the respective reservoirs of the dielectricslab 206.

In some embodiments, forming an antenna includes coupling (714) at leastone feed (e.g., first feed 224 and/or second feed 226) to the dielectricassembly (e.g., dielectric slab 206, first multi-layer PCB 202, andsecond multi-layer PCB 204). For example, the at least one feed iscoupled to the dielectric assembly by inserting the at least one feedinto the dielectric assembly (e.g., by drilling one or more holes atleast partially through the dielectric slab 206, first multi-layer PCB202, and second multi-layer PCB 204 and inserting the at least one feedinto the one or more holes). In some embodiments, the at least one feedis coupled to the dielectric assembly by attaching the at least one feedto a surface of dielectric slab 206, first multi-layer PCB 202, and/orsecond multi-layer PCB 204 with adhesive or other coupling means.

In some embodiments, coupling the at least one feed to the dielectricassembly optionally includes inserting (716) the at least one feed intothe dielectric assembly such that the at least one feed (e.g., firstfeed 224 and/or second feed 226) at least partially passes through atleast one of: the first multi-layer PCB 202, the dielectric slab 206, orthe second multi-layer PCB 204. For example, in FIG. 2, first feed 224and second feed 226 are shown passing fully through second multi-layerPCB 204, passing fully through the dielectric slab 206, and passingpartially through first multi-layer PCB 202.

In some embodiments, the at least one feed substantially (e.g., at leasthalfway) passes through (718) the first multi-layer PCB 202, the secondmulti-layer PCB 204, and the dielectric slab 206. For example, a feedsubstantially passes through a multi-layer PCB when the feed passes atleast halfway from the bottom of the multi-layer PCB to the top of themulti-layer PCB.

In some embodiments, the first and second feeds are coupled to a powersource and/or waveform generator (e.g., the power source and waveformgenerator described above in reference to FIG. 1) that provides a signalfor transmission by an assembled antenna (e.g., microstrip antenna 200,FIG. 2).

The preceding description of the disclosed embodiments is provided toenable any person skilled in the art to make or use the embodimentsdescribed herein and variations thereof. Various modifications to theseembodiments will be readily apparent to those skilled in the art, andthe generic principles defined herein may be applied to otherembodiments without departing from the spirit or scope of the subjectmatter disclosed herein. Thus, the present disclosure is not intended tobe limited to the embodiments shown herein but is to be accorded thewidest scope consistent with the following claims and the principles andnovel features disclosed herein.

Features of the present invention can be implemented in, using, or withthe assistance of a computer program product, such as a storage medium(media) or computer readable storage medium (media) having instructionsstored thereon/in which can be used to program a processing system toperform any of the features presented herein. The storage medium (e.g.,memory 106) can include, but is not limited to, high-speed random accessmemory, such as DRAM, SRAM, DDR RAM or other random access solid statememory devices, and may include non-volatile memory, such as one or moremagnetic disk storage devices, optical disk storage devices, flashmemory devices, or other non-volatile solid state storage devices.Memory (e.g., 106, 134, and/or 142) optionally includes one or morestorage devices remotely located from the CPU(s) (e.g., processor(s)104, 132, and/or 140). Memory (e.g., 106, 134, and/or 142), oralternatively the non-volatile memory device(s) within the memory,comprises a non-transitory computer readable storage medium.

Stored on any one of the machine readable medium (media), features ofthe present invention can be incorporated in software and/or firmwarefor controlling the hardware of a processing system (such as thecomponents associated with the transmitters 102 and/or receivers 120),and for enabling a processing system to interact with other mechanismsutilizing the results of the present invention. Such software orfirmware may include, but is not limited to, application code, devicedrivers, operating systems, and execution environments/containers.

Communication systems as referred to herein (e.g., communicationscomponents 112, 136, and/or 144) optionally communicate via wired and/orwireless communication connections. Communication systems optionallycommunicate with networks, such as the Internet, also referred to as theWorld Wide Web (WWW), an intranet and/or a wireless network, such as acellular telephone network, a wireless local area network (LAN) and/or ametropolitan area network (MAN), and other devices by wirelesscommunication. Wireless communication connections optionally use any ofa plurality of communications standards, protocols and technologies,including but not limited to radio-frequency (RF), radio-frequencyidentification (RFID), infrared, radar, sound, Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), high-speeddownlink packet access (HSDPA), high-speed uplink packet access (HSUPA),Evolution, Data-Only (EV-DO), HSPA, HSPA+, Dual-Cell HSPA (DC-HSPDA),long term evolution (LTE), near field communication (NFC), ZigBee,wideband code division multiple access (W-CDMA), code division multipleaccess (CDMA), time division multiple access (TDMA), Bluetooth, WirelessFidelity (Wi-Fi) (e.g., IEEE 102.11a, IEEE 102.11ac, IEEE 102.11ax, IEEE102.11b, IEEE 102.11g and/or IEEE 102.11n), voice over Internet Protocol(VoIP), Wi-MAX, a protocol for e-mail (e.g., Internet message accessprotocol (IMAP) and/or post office protocol (POP)), instant messaging(e.g., extensible messaging and presence protocol (XMPP), SessionInitiation Protocol for Instant Messaging and Presence LeveragingExtensions (SIMPLE), Instant Messaging and Presence Service (IMPS)),and/or Short Message Service (SMS), or any other suitable communicationprotocol, including communication protocols not yet developed as of thefiling date of this document.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the claims. Asused in the description of the embodiments and the appended claims, thesingular forms “a,” “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willalso be understood that the term “and/or” as used herein refers to andencompasses any and all possible combinations of one or more of theassociated listed items. It will be further understood that the terms“comprises” and/or “comprising,” when used in this specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof.

As used herein, the term “if” may be construed to mean “when” or “upon”or “in response to determining” or “in accordance with a determination”or “in response to detecting,” that a stated condition precedent istrue, depending on the context. Similarly, the phrase “if it isdetermined [that a stated condition precedent is true]” or “if [a statedcondition precedent is true]” or “when [a stated condition precedent istrue]” may be construed to mean “upon determining” or “in response todetermining” or “in accordance with a determination” or “upon detecting”or “in response to detecting” that the stated condition precedent istrue, depending on the context.

The foregoing description, for purpose of explanation, has beendescribed with reference to specific embodiments. However, theillustrative discussions above are not intended to be exhaustive or tolimit the claims to the precise forms disclosed. Many modifications andvariations are possible in view of the above teachings. The embodimentswere chosen and described in order to best explain principles ofoperation and practical applications, to thereby enable others skilledin the art.

What is claimed is:
 1. An antenna for use in a wireless powertransmission system, the antenna comprising: a first multi-layer printedcircuit board (PCB) that includes a top surface and a bottom surfacethat is opposite the top surface, wherein the top and bottom surfaces ofthe first multi-layer PCB include a first electrically conductivematerial; a second multi-layer PCB that includes a top surface and abottom surface that is opposite the top surface, wherein the top andbottom surfaces of the second multi-layer PCT include a secondelectrically conductive material, wherein the second multi-layer PCB isseparate and distinct from the first multi-layer PCB; a first pluralityof vias that each substantially pass through the top and bottom surfacesof the first multi-layer PCB; a second plurality of vias that eachsubstantially pass through the top and bottom surfaces of the secondmulti-layer PCB, wherein the second plurality of vias is separate anddistinct from the first plurality of vias; a dielectric slab that isconfigured to receive: the first multi-layer PCB, and the secondmulti-layer PCB; and a first feed that at least partially passes througheach of the first multi-layer PCB, the second multi-layer PCB, and thedielectric slab, wherein the first feed delivers a radio frequency (RF)signal at a predetermined frequency to the antenna, wherein the antennais configured to transmit the RF signal for delivering wireless power toat least one remote receiver device, and the at least one remotereceiver device is configured to convert the RF signal into usable powerfor providing power or charge to the at least one remote receiverdevice.